No-Clean Tacky Flux (High-Performance Soldering Paste), 10 ml Syringe, EO-TF-001

Description

• TF-001 flux developed specifically for extremely difficult SMD/BGA repair and rework
• No-clean tacky flux (soldering paste) based on inorganic halides; zinc-free and WEEE/RoHS compliant
• Classification: 2.2.2.C // M1 according to ISO 9454 // DIN EN 61190-1-1
• Contains no free acid or resin; despite very strong activation, it has low corrosion tendency
• No curing or crystallization effect
• Suitable for both SnPb and lead-free alloys

TF-001 is a flux developed specifically for extremely difficult SMD/BGA repair and rework. This no-clean tacky flux (soldering paste) is based on inorganic halides, is zinc-free, and complies with WEEE/RoHS requirements. Classification: 2.2.2.C // M1 according to ISO 9454 // DIN EN 61190-1-1. It contains no free acid or resin and has low corrosion tendency despite very strong activation. It does not cure or crystallize and is suitable for both SnPb and lead-free alloys.

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