CS-FLUX 5 g Low-Viscosity, Halogen-Free, Lead-Free Liquid Flux for BGA Rework and Reballing

Description

• Liquefies at approximately 150C and fully covers the gap between the BGA component and circuit board.
• Protects solder balls, pads, and components from oxidation during BGA reflow or removal.
• Not a no-clean flux; does not cause corrosion if left uncleaned and can be easily removed with alcohol when needed.
• Requires only a small amount, produces minimal fumes, and is lead-free and halogen-free.
• Highly tacky formula helps hold solder balls in the stencil during reballing.
• Suitable for BGA reflow soldering with a hot-air gun and for microsoldering.
• Made in the EU (Greece); stocked worldwide for fast shipping.

CS-FLUX is a low-viscosity liquid flux developed for BGA reballing, rework, and reflow, and is also suitable for microsoldering. It was developed by the Computer Systems research team to meet the specific flux requirements of repair soldering for commercial electronics such as laptops and game consoles. Package contents: 1 5 g syringe of CS-FLUX and 1 1.6 mm tip for easy application. No expiration date. Protect from heat and sunlight. For long-term storage, refrigeration is recommended. Made in Greece (European Union).

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